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What is DCHE?

What is DCHE?
Issue Time:2018-10-16

What is DCHE?




     The Diffusion-bonded Compact Heat Exchanger (DCHE) is a compact heat exchanger, and the demand for it is expected to increase in applications for weight saving or those calling for a compact plot area, as well as for use in floating plants.

    The Diffusion-bonded Compact Heat Exchanger (DCHE) is a compact heat exchanger with excellent heat transfer performance and high pressure resistance. In a DCHE, several hundreds of plates are stacked, each with ow passages. Significant features are the ow passage size and joining. Flow passage diameters are each several millimeters in size, to ensure a large heat transfer area per unit volume of at least 1000 m2 /m3 . The joining is accomplished by diffusion bonding, which offers high pressure resistance up to 100 MPa.

    A multitubular heat exchanger for the nitrogen compressor was replaced with the DCHE. As a result, the DCHE could be made significantly more compact, approximately 10% in volume and less than 15% in weight, compared with a multitubular heat exchanger of the same heat transfer performance and pressure loss. Also, the overall heat transfer coefficient increased to 200%. This means that the energy efficiency is improved.

Manufacturing of the DCHE:





    Relationship of form between ALEX fin and DCHE channel.

PS:ALEX means "Brazed Aluminum Heat Exchange"

Product feature of the DCHE:

1.Compact structure: 2000/m³;channel size: 0.3-1mm; Heat Conductivity: 5000W/(·K );

2.High pressure resistant: 30-50MPa;

3.High reliability, no excess, no solder clogging, welding strength is equal to material base material strength.


   Our company has a diffusion coating process capability of 500 layers, a single piece with a minimum thickness of 50um and a channel equivalent diameter of at least 30um.

Application:

    The key words of DCHE are "excellent pressure and temperature resistance," "remarkable compact size" and "high corrosion resistance".

    Owing to these features, DCHE is applicable in such applications as:

1.Limited space, such as off shore facilities. Examples: Inter-coolers and after-coolers for compressors;

2.Installed at a height, requiring compactness and lightness. Examples: Vaporizers and condensers used on towers such as distilling columns;

3.Severe operating conditions (e.g., high pressure, large temperature differences among fluids, operational fluctuations) Examples: Coolers for high-pressure hydrogen stations;

4.Material:304,304L,316,316L


    Heat exchangers for hydrogen station require compactness and reliability for operational fluctuation. DCHE achieves the same performance in less than 5% the plot area compared with a multitubular heat exchanger. The reliability of DCHE has been confirmed with stress simulation and a fatigue test under a high-pressure conditions using actual test pieces.

As the evaporator in the Water Puriffier:

    DCHE is made of multi-layer stainless steel 316L material laminated and vacuum diffusion combined. The material is food grade, high processing precision, high heat exchange and small product volume, suitable for water purifier equipment. Mainly in the water purifier system as an evaporator.


1.The microchannel heat exchanger can be increased by 10 times compared with the storage heat exchanger;

2.Small size, especially suitable for compact, ultra-small water purifier products.

Cooler for the electronics:

    HZSS’s enclosure cooling products effectively dissipate heat from sealed electrical and electronic enclosures operating in indoor, outdoor and other types of environments. These products are applicable in diverse industries including Industrial Automation, Food Processing, Chemical, Petrochemical, Wastewater Treatment, and Telecommunications.


    


    Double channel ammonia cold plate (15W) 108mm*20mm*4mm.


    Large heat exchange area, high heat transfer coefficient, suitable for equipment with high local heat flow.

    Conventional flow channel cold plate: general heat transfer coefficient, low cost, suitable for common equipment.

    Cooling performance: can meet the cooling requirements of 200-300W/cm2 device

Advantages: diffusion bonding technology has high welding strength, diverse internal flow channels, high heat transfer area and high heat transfer coefficient.